1.0 W/m·K Thermal Conductive Pad

Inquiry

The thermal conductive pad ALOS-SILI-437 is a high-performance thermal interface material specifically engineered to address the heat dissipation challenges in electronic devices. It is composed of silicone as the base material, enriched with high thermal conductivity ceramic fillers. With a thermal conductivity coefficient of 1.0 W/m·K, this thermal pad effectively fills the microscopic gaps between heat-generating components such as IC chips, power transistors, and LED modules, and their corresponding heat sinks or metal enclosures. By eliminating the presence of air in these interfaces, it significantly enhances thermal transfer efficiency. Additionally, this product offers excellent insulation and fire-resistant properties, making it suitable for a wide range of operating temperatures from -40°C to 200°C. This versatility ensures it meets the cooling demands of various devices.

Typical Parameters

Product Name	1.0 W/m·K Thermal Conductive Pad
Catalog	ALOS-SILI-437
Thickness	0.3-15 mm
Thermal Conductivity	1.0 W/m·K
Components	Silicone rubber and ceramics
Color	Gray/White
Hardness	30±5 Shore C
Density	1.8±0.1 g/cm³
Tensile Strength	≥0.25 MPa
Extensibility	≥80%
Breakdown Voltage	>12 kV/mm
Volume Resistivity	≥1.5×10¹² Ω-cm
Weight Loss	<3%
Working Temperature	-40°C to 200°C
Shape	Sheet
Flammability Rating	UL 94-V0

*The parameters of this thermal pad are for reference only. In addition, adhesive and reinforce fiberglass can be added as requested.

Properties

Flexible adaptability. It is designed to be soft and compressible, allowing it to conform perfectly to irregular and uneven surfaces. This flexibility ensures optimal contact and efficient heat transfer.
Electrical insulation. The pad typically has excellent electrical insulation properties, which are crucial for preventing short circuits in electronic devices. This ensures both safety and reliability in various applications.
Wide operating temperature range. Capable of functioning within a broad temperature spectrum, it maintains performance from -40°C to 200°C. This wide range makes it suitable for diverse environments and applications.
Ease of use. The pad comes with inherent micro-stickiness, eliminating the need for additional adhesive backing. It supports die-cut customization for easy integration into different devices and configurations.
Environmental compliance. Compliant with ROHS and REACH standards, it is designed for long-term use without powdering or volatilizing.

Directions for Use

Surface preparation. Begin by ensuring that the surfaces of the heat-generating component and the heat sink are thoroughly cleaned. Remove any dust, oils, or other contaminants to achieve optimal adhesion and thermal conductivity.
Cutting the pad. If the thermal pad is not already custom-cut to the necessary dimensions, carefully trim it to match the exact surface area of the component. Precision is key for ensuring complete coverage and effective thermal transfer.
Peeling the backing. Most thermal pads come with a protective film on both sides. Gently peel off the film from one side, taking care not to touch the exposed surface to prevent contamination from oils or dirt.
Positioning the pad. With the adhesive side facing down, carefully place the thermal pad onto the cleaned surface of the component. Apply light pressure to secure it in place and eliminate any trapped air bubbles for better contact.
Installation and tightening. After positioning the pad, remove the protective film from the other side. Align the heat sink or metal casing over the thermal pad and apply even pressure. This step ensures the thermal interface material is evenly compressed, thoroughly filling any gaps to maximize thermal performance.

Storage

The optimal storage temperature for this product is between 15°C and 25°C. When stored within this temperature range, the product maintains its quality and effectiveness for up to 12 months.

Our company's silicone thermal conductive pad, ALOS-SILI-437, is a high-performance solution designed to address diverse heat dissipation needs. We also offer customization options to tailor the thermal pad's thickness, color, shape, size, and other specifications according to our customers' unique requirements, ensuring it meets a wide range of application demands. We are committed to providing excellent service and support. Please feel free to reach out with any questions or inquiries.