1.0 W/m·K Two-component Thermal Conductive Gel

Inquiry

The ALOS-SILI-406 is a high-performance two-component silicone-based thermal conductive gel designed as an interface material to meet demanding applications requiring exceptional thermal efficiency and reliability. With a thermal conductivity of 1.0 W/m·K, this gel cures to form a soft yet highly elastic thermal layer. It effectively fills micro-gaps, facilitating excellent heat transfer, which significantly enhances device cooling efficiency and long-term stability.

Typical Parameters

Product Name	1.0 W/m·K Two-component Thermal Conductive Gel
Catalog	ALOS-SILI-406
Color	A: Gray B: White
Mixing Ratio (Weight Ratio)	A:B=1:1
Thermal Conductivity	1.0 W/m·K
Complete Curing Time	24 h (25 °C) or 15 min (100 °C)
Specific Gravity	2.35±0.5 g/cm³
Operating Temperature	-50°C to 160°C
Tensile Strength	≥0.25 MPa
Elongation at Break	≥100%
Volume Resistivity	≥1×10¹² Ω-cm
Hardness	35 shore C
Flammability Rating	UL 94-V0

Properties

Two-component formula. The ALOS-SILI-406 features an easy-to-mix and dispense two-component formulation that allows for flexible application. It can cure quickly at room or elevated temperatures to form a stable thermal conductive layer.
Outstanding reliability. Once cured, the thermal conductive gel forms a soft, non-flowing layer that boasts excellent resistance to high and low temperatures, weather, and vibrations. This ensures long-term stable performance of products even in harsh environments.
Low stress. After curing, the gel exhibits low modulus, applying minimal stress to sensitive components, thereby effectively protecting electronic parts.
Exceptional gap-filling ability. Its unique rheological properties enable it to thoroughly fill micro-gaps between uneven surfaces, significantly reducing thermal resistance.
Environmentally friendly. Compliant with RoHS directives, this gel contains no harmful substances, ensuring safe use and environmental friendliness.

Application Method

Preparation. Begin by ensuring that the substrate surfaces are clean, dry, and free from oil and dust. This step is crucial for optimal adhesion and performance of the thermal gel.
Mixing. Combine component A and component B in the recommended ratios, mixing thoroughly until a homogeneous blend is achieved. For precise and efficient mixing, it is advisable to use automatic mixing and dispensing equipment.
Dispensing. Apply the mixed thermal gel onto the desired interface using dispensing or potting techniques. You can adjust the amount and thickness of the gel according to specific application requirements.
Curing. The gel can gradually cure at room temperature, but the process can be accelerated by applying heat. Refer to the product specifications table above for detailed information on the optimal curing time and temperature settings.

Application Areas

5G base stations
Optical modules
Smartphones
Tablets
New energy vehicle engine control unit (ECU) modules
New energy vehicle battery packs
Power modules
LED chips

Our company offers the silicone thermal conductive gel ALOS-SILI-406, a high-performance solution designed to meet demanding thermal management needs. This gel is engineered to enhance heat transfer and ensure long-term stability across a variety of applications. Beyond our standard offering, we provide customized high-performance silicone thermal conductive gels tailored to meet specific customer requirements across diverse industries. We are committed to serving your needs and welcome any inquiries you may have. Please feel free to reach out to us for more detailed information or assistance.