13.0 W/m·K Thermal Conductive Pad
Inquiry
The ALOS-SILI-449 thermal conductive pad is an advanced thermal interface material developed in response to the market demand for higher heat dissipation performance. Boasting a stable thermal conductivity of 13.0 W/m·K, this thermal pad is crafted from premium silicone material and enhanced with thermally conductive ceramic fillers through a specialized manufacturing process. This material efficiently fills the gaps between heat-generating components and heat sinks, thereby reducing thermal contact resistance. Moreover, the product features inherent adhesive properties, supporting double-sided adhesion without the need for additional adhesives, thus simplifying the assembly process.
Typical Parameters
| Product Name | 13.0 W/m·K Thermal Conductive Pad |
| Catalog | ALOS-SILI-449 |
| Thickness | 0.5-5 mm |
| Thermal Conductivity | 13.0 W/m·K |
| Components | Silicone rubber and ceramics |
| Color | Gray |
| Hardness | 45-75 Shore C |
| Density | 3.5±0.5 g/cm3 |
| Breakdown Voltage | ≥4 kV/mm |
| Volume Resistivity | ≥1.0×108 Ω-cm |
| Working Temperature | -40°C to 180°C |
| Shape | Sheet |
| Flammability Rating | UL 94-V0 |
*The parameters of this thermal pad are for reference only. In addition, adhesive and reinforce fiberglass can be added as requested.
Properties
- Exceptional thermal conductivity. With an outstanding thermal conductivity of 13.0 W/m·K, this thermal pad delivers superior heat dissipation capabilities, ensuring efficient cooling for electronic devices.
- Superior electrical insulation. The pad provides safe and reliable electrical insulation, eliminating the risk of short circuits and meeting stringent safety standards.
- Excellent flexibility. Its soft and pliable nature allows it to easily conform to and fill irregular gaps, minimizing thermal contact resistance and reducing mechanical stress on electronic components.
- Outstanding environmental adaptability. Designed to withstand various environmental challenges, the pad exhibits weather resistance, moisture resistance, and shock resistance, significantly enhancing long-term reliability.
- Flame retardancy. Compliant with the UL94 V-0 flammability standard, it offers a high level of safety protection.
- Non-toxic and environmentally friendly. Manufactured from green materials, it aligns with RoHS and other environmental regulations, promoting environmental sustainability.
Applications
The ALOS-SILI-449 silicone thermal conductive pad is primarily used in the electronics and telecommunications industries, where efficient heat dissipation is crucial for maintaining the performance and longevity of electronic devices. Additionally, the ALOS-SILI-449 thermal pad is also employed in the field of artificial intelligence. With the increasing demand for AI systems that require powerful computing capabilities, effective thermal management is essential. This thermal pad helps maintain optimal operating temperatures in AI hardware, enhancing system reliability and performance.
Storage
The optimal storage temperature for this product is between 15°C and 25°C. When stored within this temperature range, the product maintains its quality and effectiveness for up to 12 months.
Our company's silicone thermal conductive pad, ALOS-SILI-449, is a high-performance solution engineered to meet the demanding heat dissipation needs across various industries. With its exceptional thermal conductivity, flexibility, and reliability, it excels in applications within the electronics, telecommunications, and artificial intelligence fields. We also offer customization options to tailor the thermal pad's thickness, color, shape, and size according to specific customer requirements, ensuring it meets diverse application needs. We are committed to providing excellent service. Please feel free to reach out to us with any questions or customization requests.