3.0 W/m·K Two-component Thermal Conductive Gel
Inquiry
The ALOS-SILI-409 is a reworkable, two-component silicone-based thermal conductive gel designed for superior thermal management, with a thermal conductivity of 3.0 W/m·K. Comprising primarily of silicone adhesive and composite ceramic fillers, its formulation leverages advanced processing technology to ensure optimal performance. This product excels in wettability, effectively minimizing thermal contact resistance, and it boasts exceptional chemical stability and low toxicity. ALOS-SILI-409 operates efficiently within a wide temperature range of -45 °C to 150 °C for extended periods and can withstand short-term exposure to temperatures as high as 200 °C. Additionally, the material is non-corrosive and offers excellent reworkability post-curing. It can be seamlessly applied using standard coating equipment, thereby ensuring high convenience and operational efficiency.
Typical Parameters
| Product Name | 3.0 W/m·K Two-component Thermal Conductive Gel |
| Catalog | ALOS-SILI-409 |
| Color | A: Light gray B: Light yellow |
| Mixing Ratio (Weight Ratio) | A:B=1:1 |
| Thermal Conductivity | 3.0 W/m·K |
| Complete Curing Time | 2 h (25 °C) or 20 min (130 °C) |
| Flow Rate | 60 g/min |
| Specific Gravity | 3.0 g/cm3 |
| Viscosity After Mixing | 200000 cps |
| Operation Time | 60 min |
| Dielectric Strength | ≥12 KV/mm |
| Volume Resistivity | ≥1×1012 Ω-cm |
| Hardness | 40±5 shore OO |
| Volatile Content | ≤4% |
| Flammability Rating | UL 94-V0 |
| Shelf Life | 10 months |
Properties
- Outstanding wettability. The product offers exceptional wettability, facilitating optimal surface contact and ensuring efficient heat transfer between components.
- Reworkability. One of the key advantages is its high reworkability, allowing for easy removal and reapplication if adjustments or repairs are needed, which enhances its versatility and cost-effectiveness.
- Superior chemical stability. With a formulation that promises excellent chemical stability, this product retains its properties over time, even under varying environmental conditions, thereby guaranteeing reliable and consistent performance.
- Environmentally friendly. Committed to environmental sustainability, the product complies with RoHS (Restriction of Hazardous Substances) standards, ensuring that it is free from harmful substances and safe for both users and the environment.
Applications
The two-component thermal conductive gel ALOS-SILI-409 is utilized across multiple sectors due to its exceptional properties:
- Printed circuit board (PCB) assemblies. This product is suitable for heat dissipation in printed circuit board (PCB) systems, ensuring efficient operation and reliability across a range of applications.
- Power resistors. This product is suitable for power resistors, maintaining their optimal performance and extending the lifespan of these critical electronic components through superior thermal conductivity.
- CPU and GPU. The thermal gel is perfectly suited for CPUs and GPUs, offering excellent heat dissipation to support high-performance computing, thus preventing overheating and ensuring stable operation.
- 5G communication devices. Given the intense processing demands of 5G communication equipment, this product provides essential thermal management, enhancing device performance and reliability in high-speed data environments.
- Automotive electronics. In the automotive industry, where electronic systems play an increasingly pivotal role, this thermal gel helps electronic components operate within safe temperature limits, contributing to the overall efficiency and safety of the vehicle.
The two-component thermal conductive gel ALOS-SILI-409 excels in heat management, making it ideal for a wide range of applications from electronics to automotive industries. Furthermore, we offer custom formulations of high-performance silicone thermal conductive gels tailored to meet specific client requirements across various sectors. We are committed to providing excellent service and welcome any inquiries for assistance or further information.
