8.0 W/m·K Thermal Conductive Pad

Inquiry

The ALOS-SILI-446 thermal conductive pad is a sheet material composed of high-performance silicone integrated with high-conductivity fillers. It boasts outstanding thermal conductivity, excellent compressibility, and softness. These features are designed to minimize stress on components like integrated circuits and provide physical protection, such as shock absorption. Simultaneously, the material maintains effective thermal contact across gaps or surfaces with rough textures, ensuring compliance where necessary. This makes it an ideal high-reliability and long-term solution across various fields, including advanced computing, defense electronics, telecom infrastructure, and automotive modules.

Typical Parameters

Product Name	8.0 W/m·K Thermal Conductive Pad
Catalog	ALOS-SILI-446
Thickness	0.5-10 mm
Thermal Conductivity	8.0 W/m·K
Components	Silicone rubber and ceramics
Color	Gray
Hardness	30-60 Shore OO
Density	3.3±0.1 g/cm³
Tensile Strength	≥0.12 MPa
Extensibility	≥50%
Breakdown Voltage	≥4 kV/mm
Volume Resistivity	≥1.5×10¹¹ Ω-cm
Weight Loss	<0.1%
Working Temperature	-40°C to 200°C
Shape	Sheet
Flammability Rating	UL 94-V0

*The parameters of this thermal pad are for reference only. In addition, adhesive and reinforce fiberglass can be added as requested.

Properties

High thermal conductivity. With a thermal conductivity value reaching up to 8.0 W/m·K, this thermal pad guarantees rapid and efficient heat transfer, effectively dissipating heat from critical components.
High compressibility. Soft and elastic, the pad readily conforms to the irregularities on the surfaces of electronic components. This enhances thermal contact and maximizes heat transfer efficiency, ensuring optimal performance.
Durability. Designed to withstand environmental challenges such as humidity, temperature fluctuations, and mechanical stress, the pad ensures lasting performance and reliability over time.
Low volatility. The material resists the exudation of silicone oils during extended use, ensuring it does not adversely affect surrounding sensitive electronic components.

Directions for Use

Preparation: Before application, thoroughly clean the surfaces that will be bonded to ensure they are free of dust and oil. Select the appropriate thermal pad size, either a standard model or a custom-cut piece, based on the dimensions of the component.
Positioning: Carefully peel off the protective film from the thermal pad. Align the pad with the component's surface where it needs to be attached.
Assembly and securing: Gently press the thermal pad onto the component's surface to ensure it adheres firmly and efficiently fills any gaps. This pressure helps optimize contact and ensures effective thermal transfer.

Storage

The optimal storage temperature for this product is between 15°C and 25°C. When stored within this temperature range, the product maintains its quality and effectiveness for up to 12 months.

Our company offers the ALOS-SILI-446 silicone thermal conductive pad, a high-performance solution designed for efficient thermal management in advanced electronics. This pad features outstanding thermal conductivity, superior compressibility, durability, and low volatility, making it ideal for a wide range of industries. We offer customization options to tailor the pad's thickness, color, shape, and size to meet the specific needs of our clients, ensuring it fits perfectly within any application. We are committed to providing exceptional service and are eager to assist with any inquiries or requirements. Please feel free to reach out with any questions you may have; our team is ready to help.