Dual-Component LED Display Potting Compound
InquiryDual-component LED display potting compound is specialized material designed to protect and enhance the performance of LED displays by encapsulating electronic components. The potting process not only shields sensitive circuitry from environmental factors such as humidity, dust, and mechanical stress but also improves thermal management, ensuring optimal heat dissipation during operation. Additionally, the potting compound can be formulated to enhance optical clarity, allowing for maximum light transmission, which is crucial for vibrant and effective LED display performance. With its quick curing times and strong mechanical properties, dual-component LED display potting compound is essential for the longevity and reliability of LED display systems. Our dual-component LED display potting compound boasts excellent thermal conductivity and cures at room temperature, although lower temperatures can prolong the curing time. It demonstrates outstanding adhesion to various materials, including polycarbonate (PC) and epoxy. This makes it an ideal choice for ensuring the durability and performance of LED displays.
Technical Parameters
| Product Name | Dual-Component LED Display Potting Compound | |
| Catalog | ALOS-SILI-217 | |
| Component | A | B |
| Use Ratio | 10 | 1 |
| Color | Transparent | Transparent |
| Viscosity | 1500 mPa·s | 50-100 mPa·s |
| Curing Time | 4h (25°C) | |
| Operation Time | 30-45 min (25°C) | |
| Hardness | 20 HSA | |
| Elongation at Break | ≥150% | |
| Using Temperature Range | -50~180°C | |
| Tensile Strength | ≥0.3 MPa | |
| Volume Resistivity | ≥1×1014 Ω·cm | |
| Dielectric Constant | 2.7-3.2 | |
| Dielectric Strength | ≥18 kV/mm | |
| Thermal Conductivity | ≥0.2 W/(m·K) | |
Features
- The dual-component LED display potting compound is completely transparent, boasts excellent fluidity and resists yellowing over time.
- The dual-component LED display potting compound offers outstanding moisture-proof and waterproof properties, ensuring longevity and durability in various environmental conditions.
- The potting compound is of the condensation type, releasing ethanol molecules that are non-corrosive to electronic components, ensuring the safety and longevity of the embedded parts.
- Additionally, the potting compound exhibits remarkable heat resistance, making it suitable for use in high-temperature applications while maintaining optimal performance.
