Flame-Retardant and Heat-Conducting Potting Compound
InquiryFlame-retardant and heat-conducting potting compounds are specialized materials used in the encapsulation of electronic components to enhance safety and reliability. These compounds are engineered to resist ignition and slow down the spread of flames, thus providing a crucial barrier in environments where fire hazards are a concern. Additionally, their heat-conducting properties allow for efficient thermal dissipation, helping to manage the heat generated by electronic devices and preventing overheating. Our flame-retardant and thermally conductive potting compound is a two-component, condensation-curing silicone sealing material that can cure at room temperature. During the curing process, it releases ethanol molecules, which ensure that it does not corrode materials such as polycarbonate (PC), polypropylene (PP), acrylonitrile butadiene styrene (ABS), polyethylene terephthalate (PET), polyvinyl chloride (PVC), copper wire, aluminum, tin, and other common substrates.
Technical Parameters
| Product Name | Flame-Retardant and Heat-Conducting Potting Compound | |
| Catalog | ALOS-SILI-212 | |
| Pre-Mixing Properties (25°C, 65%RH) | ||
| Component | A | B |
| Color | Grey | Semi-transparent solution |
| Viscosity | 6000 cP | 20-50 cP |
| Specific Gravity | ~1.54 g/cm3 | ~0.98 g/cm3 |
| Physical Properties After Mixing (25°C, 65%RH) | ||
| Mixing Ratio (Weight Ratio) | A:B=10:1 | |
| Color | Grey | |
| Viscosity After Mixing | 2800 cP | |
| Operation Time | 45 min | |
| Initial Setting Time | 4 h | |
| Complete Curing Time | 24 h | |
| Curing for 7 Days (25°C, 65%RH) | ||
| Hardness | 35±5 HSA | |
| Linear Shrinkage | 0.3% | |
| Using Temperature Range | -45~200°C | |
| Volume Resistivity | 1.0×1015 Ω·cm | |
| Dielectric Strength | ≥20 kV/mm | |
| Thermal Conductivity | ≥0.6 W/(m·K) | |
| Maximum Tensile Strength | ≥1.5 MPa | |
| Elongation at Break | ≥80% | |
| Flame Retardant | UL94 V-0 | |
*Viscosity, color and curing time can be adjusted according to the user's requirements.
Features
- This product features a gray, low-viscosity composition that offers excellent leveling properties, making it ideal for the molding of intricate electronic components.
- Upon curing, it transforms into a high-strength, rubber-like material that exhibits impressive impact resistance, thermal conductivity, and flame retardancy.
- It has excellent heat resistance, moisture resistance and cold resistance, and can significantly enhance the lifespan of electronic components when applied.
- This is a condensation-type material, and the ethanol molecules released during the curing process are non-corrosive to the components.
- Remarkably, this product does not require any additional primer, demonstrating exceptional adhesion to various substrates such as polycarbonate (PC), polyethylene terephthalate (PET), epoxy, polyphenylene oxide (PPO), and polyvinylidene fluoride (PVDF).
