High temperature conductive carbon paste is a specialized material designed for applications requiring excellent electrical conductivity and thermal stability at elevated temperatures. It consists of finely dispersed carbon particles mixed with a compatible binder, allowing it to maintain its performance under harsh conditions. High temperature conductive carbon paste is printed on metal and glass to connect conductive wires, such as membrane switches, computer keyboards, home appliance control panels and buttons. Its ability to provide reliable electrical connections while withstanding extreme thermal stress makes it a preferred choice in various high-performance industries.
High Temperature Conductive Carbon Paste
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Technical Parameters
| Product Name | High Temperature Conductive Carbon Paste |
| Catalog | ALOS-SILI-383 |
| Solid Content | 55% |
| Fineness | 5 μm |
| Viscosity | 15000-30000 mPa·s |
| Curing Process | 10 min (450°C) |
| Sheet Resistance | 8-10 kΩ/□ |
| Coating Area | 150-200 cm2/g |
| Applied Temperature | ≤350°C |
| pH | 1-2 |
Performance
- Exceptional electrical conductivity. The high temperature conductive carbon paste demonstrates outstanding electrical conductivity, making it highly effective for various electronic applications.
- Superior thermal conductivity. The high temperature conductive carbon paste exhibits excellent thermal conductivity, ensuring efficient heat dissipation in demanding environments and enhancing the overall performance of electronic devices. This property makes it suitable for use in power electronics and high-frequency applications where heat generation is a concern.
- High reliability. Designed to withstand extreme temperatures and conditions, the high temperature conductive carbon paste offers high reliability, ensuring consistent performance and longevity in critical applications.
- Strong adhesive properties. The high temperature conductive carbon paste showcases impressive bonding strength, allowing it to adhere effectively to a range of substrates, which is crucial for maintaining structural integrity in composite materials. This characteristic is critical in applications where materials must remain securely attached under thermal cycling or mechanical load.
- Outstanding printability. Its remarkable printability facilitates easy application in manufacturing processes, enabling precise and uniform layer deposition essential for high-quality electronic components.
