Power Supply Potting Compound
InquiryPower supply potting compound is a specialized material used to encase and protect electronic components within power supply units. The primary purpose of power supply potting compound is to provide a robust barrier against environmental factors such as moisture, dust, and vibration, which can negatively impact performance and reliability. Additionally, power supply potting compound can effectively dissipate heat generated during operation, ensuring optimal functionality. It also serves to minimize electromagnetic interference (EMI) and improve the longevity of the components by preventing corrosion and mechanical damage. Our power supply potting compound is cured using a platinum catalyst, which can be inhibited by the presence of nitrogen, sulfur, phosphorus, and organic tin compounds. Therefore, when applying it on circuit boards, it is crucial to thoroughly clean any residue of rosin from the surface. Additionally, we recommend using solder with low lead content to minimize potential interference with the curing process.
Technical Parameters
| Product Name | Power Supply Potting Compound | |
| Catalog | ALOS-SILI-213 | |
| Component | A | B |
| Use Ratio | 1 | 1 |
| Color | White | Black |
| Viscosity | 2000-2500 mPa·s | 3500-4000 mPa·s |
| Density | 0.97 g/cm3 | |
| Curing Time | 5-6h (25°C), 1h (100°C) | |
| Operation Time | 40-60 min (25°C) | |
| Hardness | 55-70 HSA | |
| Using Temperature Range | -40~200°C | |
| Volume Resistivity | 1.0×1015 Ω·cm | |
| Refractive Index | 1.404 | |
| Tensile Strength | ≥1.5 MPa | |
| Flame Retardant | UL94 V-1 | |
*Viscosity, color and curing time can be adjusted according to the user's requirements.
Features
- The power supply potting compound cures at room temperature, with the option to accelerate the curing process through heating.
- This potting compound formulation is solvent-free and produces no by-products during application, resulting in minimal shrinkage.
- Additionally, power supply potting compound exhibits excellent dielectric properties alongside superior thermal conductivity, making it an ideal choice for a variety of electronic applications.
