| Application |
Improve the package reliability of electronic potting materials and other sealing materials. Enhance the adhesion of sealant: polyurethane, acrylic, epoxy, silicon rubber to glass and metal. An excellent adhesion promoter for resins: such as epoxy resin, phenolic resin, polyester resin, polysulfide rubber, polyamide, acrylic resin, PBT, polyurethane and so on. |
| Packaging |
material. Meanwhile, as a bondin g accelerator, it can be used as adhesion promoter, surface modifier, dispersant, mainly used to improve the bindin g and compatibility between inor ganic mineralpowders or fiber to polymer (resin), and attached force and water resistance of resin coatin g on the inor ganic substrate. Typical Technical Data Appearance: Colorless transparent liquid Specific gravity (ρ20°C, g/cm3): 1.060~1.070 Refractive Index ( ): 1.4400~1.4560 Purity (by gC, %): 98.0 min Applications Improve the packa ge reliability of electronic pottin g materials and other sealin g materials. Enhance the adhesion of sealant: polyurethane, acrylic, epoxy, silicon rubber to glass and metal. An excellent adhesion promoter for resins: such as epoxy resin, phenolic resin, polyester resin, polysulfide rubber, polyamide, acrylic resin, PBT, polyurethane and so on. Packa gin g In 25 Kg pail, 200 Kg drum and 970 Kg |
