Fluorosilane
The chemical category of fluorosilane consists of organosilicon substances that hold silicon-fluorine connections which follow the chemical formulas R₃SiF or R₂SiF₂ (R stands for an organic group). Fluorosilane exists as a non-toxic gas that lacks color and odor and maintains stable chemical properties while being unable to sustain combustion. Fluorosilane serves multiple purposes throughout industrial production processes.

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What is Fluorosilane?
Fluorosilane is a silane compound composed of silicon and fluorine. Fluorosilane has a low boiling point and low density, and some fluorosilanes are in liquid state. The Si-F bond is highly stable and resistant to hydrolysis; it has strong surface activity and can achieve super hydrophobic and antifouling functions through the terminal fluorocarbon chain.
What are the Features of Fluorosilane?
Chemical Stability
Fluorosilanes have high resistance to hydrolysis and chemical corrosion.
Excellent Surface Properties
Fluorosilanes have ultra-low surface energy and self-cleaning properties.
Thermal Stability and Temperature resistance
Some fluorosilane-based materials can maintain stable performance in the range of -89°C to 232°C.
Fluorosilanes Products List
What are the Applications of Fluorosilane?

Industrial Material Additives
Fluorosilane can be used as rubber and coating modification and silicon steel protection.

Surface Treatment and Functional Coatings
Fluorosilane can be used as electronic device coatings and has self-cleaning and anti-fouling functions.

Electronics and Semiconductor Manufacturing
Fluorosilane can be used as a semiconductor material desiccant and is used in semiconductor production environments.

Precision Manufacturing and High-end Materials
As a key component of fluorosilicone materials, it is widely used in strategic industries such as new energy.
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Case Study
Ultrathin Fluorosilane Films for Surface Modification of Biomedical Nanodevices

Ultrathin coatings of fluorosilane films on silicon and polydimethylsiloxane (PDMS) help control the hydrophobicity of the surface and reduce or prevent unwanted protein adsorption or cellular interactions that are critical to the performance of most biomedical micro/nano devices. Surface modification using vapor deposition is becoming increasingly important for some biomedical nanodevices and has advantages over liquid deposition because the vapor phase can more efficiently penetrate into silicon nanochannels. Ultrathin films of four fluorosilanes were deposited on silicon and PDMS using vapor deposition and the deposition conditions for the optimal process were determined.
For the fluorosilane deposition, a steady-state chamber pressure was achieved by flow control of the carrier nitrogen gas and vacuum lines. The carrier gas was used to remove excess unreacted chemicals. The deposition process was followed by a 20-minute annealing step. After the deposition process was completed, the inlet/outlet valves were closed to isolate the glass tubes and the chamber was evacuated. After the deposition was completed, the bypass carrier gas line was opened to introduce pure nitrogen into the vacuum chamber to complete the removal of byproducts and unreacted chemicals. Finally, the samples were removed from the vacuum chamber and transferred to a vacuum desiccator until characterization.